My apologies if this has been gone over several times already, however I was unable to find this problem in the sea of "H100i backplate loose" posts.
Is there a common or uncommon user problem that prevents the h100i from making good and firm contact with the CPU?
I am having difficulty with my H100i and the force exerted (or the lack thereof) upon my CPU. It seems that just as the bracket that holds the cooler to the CPU starts to encounter resistance, the threads run out and it can not be further tightened.
Initially, i experienced very high temperatures (>90ºC) within 1.5 seconds of stress testing with prime 95 on my i7 4790K processor and the H100i temperature would not keep pace with the CPU temps (increase of 70ºC on CPU corresponded to a very slow increase of 6ºC on the pump after 30 min.) I found that i could insert four slices of a business card to increase the pressure between the H100i and the processor, which lowered the temperature significantly (<75ºC) for a sustained period and the pump temperature corresponded with the CPU temperature.
Recently, my CPU temps have been climbing again, though the pump temperature also climbs, just not as much as before. I have no problem cooling the pump, it doesn't go over 40ºC.
I would make the conjecture that if I could provide more force against the CPU, that I would get better thermal conductance
Other than using improper grammar, what am I doing wrong?
pertinent information for mechanical tolerances: i7 4790K, ASUS MaximusVII Formula, antec 7 diamond nano paste (stained, squeezed, wiggled, twisted and massaged to ensure even and thin dispersal.)
Is there a common or uncommon user problem that prevents the h100i from making good and firm contact with the CPU?
I am having difficulty with my H100i and the force exerted (or the lack thereof) upon my CPU. It seems that just as the bracket that holds the cooler to the CPU starts to encounter resistance, the threads run out and it can not be further tightened.
Initially, i experienced very high temperatures (>90ºC) within 1.5 seconds of stress testing with prime 95 on my i7 4790K processor and the H100i temperature would not keep pace with the CPU temps (increase of 70ºC on CPU corresponded to a very slow increase of 6ºC on the pump after 30 min.) I found that i could insert four slices of a business card to increase the pressure between the H100i and the processor, which lowered the temperature significantly (<75ºC) for a sustained period and the pump temperature corresponded with the CPU temperature.
Recently, my CPU temps have been climbing again, though the pump temperature also climbs, just not as much as before. I have no problem cooling the pump, it doesn't go over 40ºC.
I would make the conjecture that if I could provide more force against the CPU, that I would get better thermal conductance
Other than using improper grammar, what am I doing wrong?
pertinent information for mechanical tolerances: i7 4790K, ASUS MaximusVII Formula, antec 7 diamond nano paste (stained, squeezed, wiggled, twisted and massaged to ensure even and thin dispersal.)
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